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Mohamed Ariff, Azmah Hanim and M. N., Mohamad Aznan and R., Muhammad Raimi and A., Muhammad Azrol Amin
(2016)
Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging.
Materials Science Forum, 864.
pp. 175-179.
ISSN 0255-5476; ESSN: 1662-9752