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Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging


Citation

Mohamed Ariff, Azmah Hanim and M. N., Mohamad Aznan and R., Muhammad Raimi and A., Muhammad Azrol Amin (2016) Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging. Materials Science Forum, 864. pp. 175-179. ISSN 0255-5476; ESSN: 1662-9752

Abstract

This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7wt.%) reinforced with 0.01 wt.% of Multi-Walled Carbon Nanotubes (MWCNTs) were soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Isothermal aging at 150°C for 400h, 800h, and 1200h were conducted after as reflow process. The IMC layer were analysed using optical microscope with image analyzer. The results shows the thickness of IMC layer for both ENIG and ImSn increased as the isothermal aging period increases. The increament was found from 1.49 μm to 1.73 μm for ENIG and 2.51 μm to 5.49 μm for ImSn. Floating IMC and voids formation were also observed on both pad finishes. Wetting angle for ENIG and ImSn varied from 16.21° to 36.85° and 24.27° to 34.41° respectively.


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Official URL or Download Paper: https://www.scientific.net/MSF.864.175

Additional Metadata

Item Type: Article
Subject: SAC237; Multi-walled carbon nanotubes; ENIG; Immersion tin; As reflow; Isothermal aging; Intermetallic compound
Divisions: Faculty of Engineering
Institute of Tropical Forestry and Forest Products
DOI Number: https://doi.org/10.4028/www.scientific.net/MSF.864.175
Publisher: Trans Tech Publications
Depositing User: Nurul Ainie Mokhtar
Date Deposited: 03 Apr 2018 01:16
Last Modified: 03 Apr 2018 01:16
Altmetrics: http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.4028/www.scientific.net/MSF.864.175
URI: http://psasir.upm.edu.my/id/eprint/54598
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