Items where Author is "Osman, Saliza Azlina"

Mohamed Ariff, Azmah Hanim and Chuan, Khang Wei and Temitope T., Dele-Afolabi and Osman, Saliza Azlina (2021) Shear analysis of rice husk ash RHA reinforced tin- 0.7-copper composite solders on electroless nickel/immersion silver ENIAg surfaces. Materialwissenschaft und Werkstofftechnik, 52 (9). 943 - 951. ISSN 0933-5137; ESSN: 1521-4052

Mohamed Ariff, Azmah Hanim and N., Muhamad Kamil and Wei, Chuan Khang and Temitope T., Dele-Afolabi and Osman, Saliza Azlina (2020) Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics, 31 (11). 8316 - 8328. ISSN 0957-4522; ESSN:1573-482X

Mohamed Ariff, Azmah Hanim and Ourdjini, Ali and Idris, Siti Rabiatul Aisha and Osman, Saliza Azlina (2015) Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes. Journal of Mechanical Engineering and Sciences, 9. pp. 1572-1579. ISSN 2289-4659; ESSN: 2231-8380

Mohamed Ariff, Azmah Hanim and Ourdjini, Ali and Idris, Siti Rabiatul Aisha and Osman, Saliza Azlina (2013) Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders. Advanced Materials Research, 650. pp. 194-199. ISSN 1022-6680; ESSN: 1662-8985

Mat Hussin, Nur Liyana and Mohamed Ariff, Azmah Hanim and Sulaiman, Shamsuddin and Osman, Saliza Azlina (2015) Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. .

Osman, Saliza Azlina and Ourdjini, Ali and Mohamed Ariff, Azmah Hanim (2014) The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish. In: 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT), 11-13 Nov. 2014, Johor Bahru, Johor, Malaysia. .