Citation
Mat Hussin, Nur Liyana and Mohamed Ariff, Azmah Hanim and Sulaiman, Shamsuddin and Osman, Saliza Azlina
(2015)
Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging.
In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. .
Abstract
Sn-Ag-Cu lead free solder is a well-known studied material replacing the Sn-Pb solder which is prohibited due to the toxicity of lead. Even though it is proven to have good reliability and mechanical properties, Sn-Ag-Cu is lacking in terms of melting point and wettability. Previously, research has been focused on further enhancement of Sn-Ag-Cu solder by addition of alloying elements, nanoparticles and others. In this paper, a critical review of the work on the enhancement of the mechanical and physical properties of Sn-Ag-Cu solder using this method for its application in electronic packaging is explored.
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Additional Metadata
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Divisions: | Faculty of Engineering Institute of Tropical Forestry and Forest Products |
| Keywords: | Lead-free solders; Sn-Ag-Cu; Mechanical properties; Physical properties |
| Depositing User: | Nabilah Mustapa |
| Date Deposited: | 12 Feb 2019 06:46 |
| Last Modified: | 12 Feb 2019 06:46 |
| URI: | http://psasir.upm.edu.my/id/eprint/66184 |
| Statistic Details: | View Download Statistic |
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