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Items where Author is "Nadzri, Allina"

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Article

Harif, Muhammad Najib and Nadzri, Allina and Jusoff, Kamaruzaman (2010) Lead free solder joint thermal condition in semiconductor packaging. American Journal of Applied Sciences, 7 (7). pp. 949-953. ISSN 1546-9239; ESSN: 1554-3641

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