Items where Author is "Nadzri, Allina"
 | Up a level |
Group by: Item Type | No Grouping
Number of items: 1.
Harif, Muhammad Najib and Nadzri, Allina and Jusoff, Kamaruzaman
(2010)
Lead free solder joint thermal condition in semiconductor packaging.
American Journal of Applied Sciences, 7 (7).
pp. 949-953.
ISSN 1546-9239; ESSN: 1554-3641