Drop impact testing for Pb-freee aloy on IC packaging

Citation

Ismail, Noor Faezah and Sulaiman, Nasri and Md Yunus, Nurul Amziah (2015) Drop impact testing for Pb-freee aloy on IC packaging. In: 3rd International Symposium on Applied Engineering and Sciences (SAES2015), 23-24 Nov. 2015, Universiti Putra Malaysia. (pp. 288-290).

Abstract

Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in a proper way so that it will produce a good interconnection while a bad interconnection can cause a weak adhesion, which lead to bad results and minimize the lifetime of the devices. The heavy the weight of object, the stronger impact force will be experienced.

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Additional Metadata

Item Type:	Conference or Workshop Item (Paper)
Divisions:	Faculty of Engineering
Publisher:	Faculty of Computer Science and Information Technology, Universiti Putra Malaysia
Keywords:	IC packaging; Soldering; Impact testing
Depositing User:	Nabilah Mustapa
Date Deposited:	04 Mar 2020 06:57
Last Modified:	04 Mar 2020 06:57
URI:	http://psasir.upm.edu.my/id/eprint/77196
Statistic Details:	View Download Statistic

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