Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes

Citation

Mohd Najib, Mohamad Aznan and Mohamed Ariff, Azmah Hanim and Roslan, Muhammad Raimi and Anuar, Muhammad Azrol Amin (2015) Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. .

Abstract

The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs) was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyzer. Results show that the thickness of IMC layer for ENIG and ImSn were 1.49 µm and 2.51 µm respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°.

Download File

Preview

Text (Abstract)
Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes.pdf
Download (37kB) | Preview

Additional Metadata

Item Type:	Conference or Workshop Item (Paper)
Divisions:	Faculty of Engineering Institute of Tropical Forestry and Forest Products
Keywords:	SA237; Multi-walled carbon nanotubes; Electroless nickel immersion gold; Immersion tin; Intermetallic compound
Depositing User:	Nabilah Mustapa
Date Deposited:	12 Feb 2019 06:46
Last Modified:	12 Feb 2019 06:46
URI:	http://psasir.upm.edu.my/id/eprint/66182
Statistic Details:	View Download Statistic

Actions (login required)

View Item