DMTA studies of the effect of storage time on the curing process of sheet moulding compound

Citation

Hamdan, Sinin and Awang Hashim, Dayang Maryani and Fong, S. W. (1998) DMTA studies of the effect of storage time on the curing process of sheet moulding compound. High Performance Polymers, 10 (4). pp. 331-340. ISSN 0954-0083

Abstract

The application of the dynamic mechanical thermal analysis (DMTA) test method in the study of the effect of storage time on the curing process of sheet moulding compound (SMC) is discussed. Emphasis is placed on following the curing by the study of storage modulus and loss tangent with storage time. Changes in the storage time showed an increase in the storage modulus (log E′) during a room-temperature cure. The loss tangent (tan δ) damping peak occurs as the system is driven into the glassy state by the cross-linking reaction. The SMC displayed a room-temperature log E′ of 8.5 Pa which increased to approximately 9 Pa in the subsequent scan in the DMTA.

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Official URL or Download Paper: http://journals.sagepub.com/doi/abs/10.1088/0954-0...

Additional Metadata

Item Type:	Article
Divisions:	Universiti Putra Malaysia
DOI Number:	https://doi.org/10.1088/0954-0083/10/4/001
Publisher:	IOP Publishing
Keywords:	Dynamic mechanical thermal analysis (DMTA); Curing process; Storage time; Sheet moulding compound
Depositing User:	Nabilah Mustapa
Date Deposited:	02 May 2017 04:40
Last Modified:	15 Oct 2024 04:11
Altmetrics:	http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.1088/0954-0083/10/4/001
URI:	http://psasir.upm.edu.my/id/eprint/51152
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