Citation
Abstract
An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb amount, and reflow number on the microstructure and morphology of solder bulk were analysed by optical microscope and scanning electron microscope-energy dispersive X-ray. Based on the results, the grain boundary grooving was observed in all samples except Bi-5Sb in all three reflows. Metallurgical and chemical reaction between interface and solders were found in Bi-5Sb solder alloys in different reflow numbers which lead to appearance of Cu3Sb intermetallic compound layer at the interface. Reflow numbers had a significant effect on the size of Cu-rich phase. Also it was observed that, with increasing reflow number Bi-Cu phase found in Bi-2.5Sb solder dissolves into the solder bulk.
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Official URL or Download Paper: http://www.scientific.net/AMM.564.388
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Additional Metadata
| Item Type: | Article |
|---|---|
| Divisions: | Faculty of Engineering Institute of Tropical Forestry and Forest Products |
| DOI Number: | https://doi.org/10.4028/www.scientific.net/AMM.564.388 |
| Publisher: | Trans Tech Publications |
| Keywords: | Bi-Ag solder alloy; Bi-Sb solder alloy; Grain boundary grooving; Intermetallic compound (IMC); Lead-free solder; Multiple reflow number |
| Depositing User: | Nurul Ainie Mokhtar |
| Date Deposited: | 19 Sep 2016 03:17 |
| Last Modified: | 19 Sep 2016 03:17 |
| Altmetrics: | http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.4028/www.scientific.net/AMM.564.388 |
| URI: | http://psasir.upm.edu.my/id/eprint/34519 |
| Statistic Details: | View Download Statistic |
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