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UPM, NXP jalin MoU perkasa jaringan industri semikonduktor dan elektronik


Citation

Universiti Putra Malaysia (2024) UPM, NXP jalin MoU perkasa jaringan industri semikonduktor dan elektronik. [UPM News]

Abstract

SERDANG, 3 Oktober - Universiti Putra Malaysia (UPM) menjalinkan kerjasama strategik dengan syarikat NXP Malaysiamenerusi Fakulti Kejuruteraan (FK) melalui Memorandum Persefahaman (MoU) bagi memperkasakan jaringan industri semikonduktor dan elektronik.


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Additional Metadata

Item Type: UPM News
Divisions: Universiti Putra Malaysia
Publisher: Pusat Strategi Dan Perhubungan Korporat, Universiti Putra Malaysia
Keywords: NXP Malaysia; NXP; FK; MoU; Minister of Science, Technology and Innovation; Tuan Chang Lih Kang; UPM-NXP Collaborative Laboratory; Wire bonder machine; Dato' Prof. Dr. Ahmad Farhan Mohd. Sadullah; Strategic collaboration; Industrial research; Engineering education; High technology; Graduates; Professor Ir. Dr. Mohd Zainal Abidin Ab. Kadir; Sivarubini Macelamany; Bachelor of electrical and electronic engineering with honours; Career opportunities; Theory and practical knowledge gap; Practical learning; Global industry; Technological innovation; Talent development; Value chain; Technology ecosystem
Depositing User: Pelajar Latihan Industri
Date Deposited: 28 Oct 2025 03:22
Last Modified: 28 Oct 2025 03:22
URI: http://psasir.upm.edu.my/id/eprint/121131
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