Citation
Mohamed Ariff, Azmah Hanim and As'arry, Azizan and Abdul Aziz, Nuraini
(2024)
Bismuth addition in Sn-Ag-Cu lead-free solder.
In:
Advanced Engineering Materials and Composites: Properties, Fabrication, and Applications.
Faculty of Engineering, Universiti Putra Malaysia, Malaysia, pp. 76-79.
ISBN 9786299731528
Abstract
Sn-Ag-Cu solder is a form of solder to replace Sn-Pb solder in electronic device soldering. Sn-Ag-Cu however, consists of various weaknesses when compared to traditional Sn-Pb solder in terms of mechanical properties and reliability. Alloying with elements such as bismuth, can be one of the methods to improve the solder properties. Therefore, a short review is carried out to understand the improved performance with bismuth doping in the solder melting temperature and reliability testing.
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Additional Metadata
| Item Type: | Book Section |
|---|---|
| Divisions: | Faculty of Engineering |
| Publisher: | Faculty of Engineering, Universiti Putra Malaysia |
| Keywords: | Sn-Ag-Cu; Bismuth; Alloying; Reliability; Mechanical cycling |
| Depositing User: | Ms. Zaimah Saiful Yazan |
| Date Deposited: | 09 Apr 2025 08:28 |
| Last Modified: | 09 Apr 2025 08:28 |
| URI: | http://psasir.upm.edu.my/id/eprint/116512 |
| Statistic Details: | View Download Statistic |
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