Citation
Abstract
A method of manufacturing a high electron mobility transistor (1), said method comprising the steps of: − providing a target wafer (10) comprising a target substrate (100); − providing a donor wafer (20) comprising an epitaxial donor film (21); − bonding said donor film (21) to said target wafer (10); − separating said donor wafer (20) and said target wafer (10) along said first donor III-N layer (201), thereby forming on said target wafer (10) a top surface layer (221) of 200nm or less; − epitaxially growing an epitaxial III-N semiconductor layer stack (300) on top of said top surface layer (221); − forming a gate contact (41) in a gate region (401); and − forming a substrate galvanic contact (42) contacting said target substrate (100).
Download File
Full text not available from this repository.
|
Additional Metadata
Item Type: | Patent |
---|---|
Application Number: | PI2024005657 |
Filing Date: | 2024-12-28 |
Divisions: | Faculty of Engineering |
Keywords: | System on Chip (SoC); FPGA; Multimode vehicle data communication; High electron mobility transistor (HEMT); Wafer bonding; Epitaxial growth; III-N semiconductors; Gate contact; Substrate contact; 200nm; Semiconductor manufacturing |
Depositing User: | Mr. Mohamad Syahrul Nizam Md Ishak |
Date Deposited: | 06 Mar 2025 05:53 |
Last Modified: | 06 Mar 2025 05:53 |
URI: | http://psasir.upm.edu.my/id/eprint/115514 |
Statistic Details: | View Download Statistic |
Actions (login required)
![]() |
View Item |