Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD).

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