Citation
Abstract
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) function method is used to formulate this crack phenomenon into the hypersingular integral equations (HSIEs) with the help of the continuity conditions of the resultant electric force and displacement electric function. The normal and tangential traction along the crack segment serves as the right-hand side of the integral equation. The HSIEs are solved numerically for the unknown crack opening displacement (COD) function, electric current density, and energy flux load using the appropriate quadrature formulas. The numerical solution presented the behavior of the dimensionless stress intensity factors (SIFs) at the crack tips which depend on the elastic constant’s ratio, the position of the crack, the electric conductivity, and the thermal expansion coefficients.
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Additional Metadata
Item Type: | Article |
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Divisions: | Faculty of Science Institute for Mathematical Research |
DOI Number: | https://doi.org/10.3390/sym13020235 |
Publisher: | MDPI |
Keywords: | Two cracks; Dissimilar materials; Hypersingular integral equations; Stress intensity factors; Numerical solution; Crack phenomenon; Material behavior; Elastic constants; Stress intensity factors; Engineering applications |
Depositing User: | Mr. Mohamad Syahrul Nizam Md Ishak |
Date Deposited: | 12 May 2024 13:19 |
Last Modified: | 12 May 2024 13:19 |
Altmetrics: | http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.3390/sym13020235 |
URI: | http://psasir.upm.edu.my/id/eprint/106276 |
Statistic Details: | View Download Statistic |
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