UPM Institutional Repository

Browse by Journal Title

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Creators | Item Type | No Grouping
Jump to: A
Number of items: 1.

A

Arunasalam, Mageswaran and Leman, Zulkiflle and Baharudin, B. T. Hang Tuah and Sulaiman, Shamsuddin and Das, Charles Santhakumar Anthony (2022) Challenges in minimizing copper dissolution for lead free wave soldering in surface mount technology going towards green manufacturing. International Journal of Precision Engineering and Manufacturing-Green Technology, 9. 645 - 660. ISSN 2288-6206; ESSN: 2198-0810

This list was generated on Tue May 7 01:39:31 2024 +08.