Items where Author is "Wei, Chuan Khang"
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Mohamed Ariff, Azmah Hanim and N., Muhamad Kamil and Wei, Chuan Khang and Temitope T., Dele-Afolabi and Osman, Saliza Azlina
(2020)
Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish.
Journal of Materials Science: Materials in Electronics, 31 (11).
8316 - 8328.
ISSN 0957-4522; ESSN:1573-482X