Items where Author is "Senthilkumar, K."

Chandrasekar, M. and Shahroze, R. M. and Kumar, T. Senthil Muthu and Senthilkumar, K. and Ishak, M. R. and Rajini, N. and Siengchin, S. (2022) Influence of a silica aerogel filler on the mechanical, thermal, and physical properties of flax/epoxy composite. Mechanics of Composite Materials, 58 (2). 271 - 282. ISSN 0191-5665; ESSN: 1573-8922

Senthilkumar, K. and Chandrasekar, M. and Alothman, Othman Y. and Fouad, Hassan and Jawaid, M. and Jawaid, M. (2022) Flexural, Impact and dynamic mechanical analysis of hybrid composites: olive tree leaves powder/ pineapple leaffibre/epoxy matrix. Journal of Materials Research and Technology, 21. 4241 - 4252. ISSN 2238-7854; ESSN: 2214-0697

Muthu Kumar, T. Senthil and Chandrasekar, M. and Senthilkumar, K. and Ilyas, R. A. and Salit, Mohd Sapuan and Hariram, N. and Rajulu, A. Varada and Rajini, N. and Siengchin, Suchart (2021) Characterization, thermal and antimicrobial properties of hybrid cellulose nanocomposite films with in-situ generated copper nanoparticles in tamarindus indica nut powder. Journal of Polymers and the Environment, 29. 1134 - 1142. ISSN 1566-2543; ESSN: 1572-8900

Alothman, Othman Y. and Jawaid, Mohammad and Senthilkumar, K. and Chandrasekar, M. and Alshammari, Basheer A. and Fouad, H. and Hashem, Mohamed and Siengchin, Suchart (2021) Thermal characterization of date palm/epoxy composites with fillers from different parts of the tree. Journal of Materials Research and Technology, 9 (6). 15537- 15546. ISSN 2238-7854; ESSN: 2214-0697

Senthilkumar, K. and Saba, N. and Rajini, N. and Chandrasekar, M. and Jawaid, M. and Siengchin, Suchart and Alotmane, Othman Y. (2018) Mechanical properties evaluation of sisal fibre reinforced polymer composites: a review. Construction and Building Materials, 174. 713 - 729. ISSN 0950-0618, ESSN: 1879-0526

Senthilkumar, K. and Thirunavukarasu, Kalaivani and Kanagesan, Samikannu and Balasubramanian, V. and Balakrishnan, J. (2013) Wurtzite ZnSe quantum dots: synthesis, characterization and PL properties. Journal of Materials Science: Materials in Electronics, 24 (2). pp. 692-696. ISSN 0957-4522; ESSN: 1573-482X