Items where Author is "Lin, Ong Jun"
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Number of items: 2.
Article
Mohamed Ariff, Azmah Hanim and Mei Mei, Amy Voo and Lin, Ong Jun
(2025)
Beyond lead: exploring fillers and reinforcements in lead-free solder technology.
Engineering Headway, 15.
pp. 55-62.
ISSN 2813-8333
Lin, Ong Jun and Mohamed Ariff, Azmah Hanim and Abdul Aziz, Nuraini and As’arry, Azizan
(2025)
Thermal and mechanical stability of bismuth doped Sn-Ag-Cu lead-free solder: a comprehensive review.
Pertanika Journal of Science and Technology, 33 (3).
pp. 1159-1183.
ISSN 0128-7680; eISSN: 2231-8526