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Stress intensity factors for bonded two half planes weakened by thermally insulated cracks


Citation

Hamzah, K. B. and Nik Long, N. M. A. and Senu, N. and Eshkuvatov, Z. K. (2020) Stress intensity factors for bonded two half planes weakened by thermally insulated cracks. Acta Mechanica, 231 (10). 4157 - 4183. ISSN 0001-5970

Abstract

The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given.


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Additional Metadata

Item Type: Article
Divisions: Institute for Mathematical Research
DOI Number: https://doi.org/10.1007/s00707-020-02753-0
Publisher: Springer Wien
Keywords: Thermally insulated cracks; Plane; Thermal influence
Depositing User: Nurul Ainie Mokhtar
Date Deposited: 04 Oct 2023 04:40
Last Modified: 04 Oct 2023 04:40
Altmetrics: http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.1007/s00707-020-02753-0
URI: http://psasir.upm.edu.my/id/eprint/85934
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