Investigating the impact of on-chip interconnection noise on dynamic thermal management efficiency

Citation

Rahimipour, Somayeh and Flayyih, Wameedh Nazar and Kamsani, Noor Ain and Stan, Mircea and Rokhani, Fakhrul Zaman (2015) Investigating the impact of on-chip interconnection noise on dynamic thermal management efficiency. In: 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2015), 29 June-2 July 2015, Glasgow, United Kingdom. (pp. 117-120).

Abstract

Dynamic Thermal Management (DTM) emerged as a solution to address the reliability challenges with thermal hotspots and unbalanced temperatures. DTM efficiency is highly affected by the accuracy of the temperature information presented to the DTM manager. This work aims to investigate the effect of inaccuracy caused by the deep sub-micron (DSM) noise during the transmission of temperature information to the manager on DTM efficiency. A simulation framework has been developed and results show up to 62% DTM performance degradation under DSM noise. The finding highlights the importance of further research in providing reliable on-chip data transmission in DTM application.

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Additional Metadata

Item Type:	Conference or Workshop Item (Paper)
Divisions:	Faculty of Engineering
DOI Number:	https://doi.org/10.1109/PRIME.2015.7251348
Publisher:	IEEE
Keywords:	DTM; DSM noise; Performance
Depositing User:	Nabilah Mustapa
Date Deposited:	08 Jul 2019 02:44
Last Modified:	08 Jul 2019 02:44
Altmetrics:	http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.1109/PRIME.2015.7251348
URI:	http://psasir.upm.edu.my/id/eprint/69673
Statistic Details:	View Download Statistic

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