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Metallization process for alumina substrates


Citation

Mohd Shapee, Sabrina and Alias, Rosidah and Ibrahim, Azmi and Yahya, Mohamed Razman and Awang Mat, Abdul Fatah and Hashim, Mansor (2005) Metallization process for alumina substrates. In: International Advanced Technology Congress: Conference on Advanced Materials (CAM 2005), 6-8 Dec. 2005, Putrajaya, Malaysia. (pp. 181-184).

Abstract / Synopsis

Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating substrate like alumina substrates. Three fundamental methods of metallizing alumina substrates include thick film, thin film and copper metallization technology. In this paper, the RF magnetron sputtering method was used to deposit copper conductor on alumina substrate surface.


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Additional Metadata

Item Type: Conference or Workshop Item (Paper)
Divisions: Faculty of Science and Environmental Studies
Publisher: Universiti Putra Malaysia Press
Keywords: Metallization; Alumina substrates
Depositing User: Erni Suraya Abdul Aziz
Date Deposited: 03 Jun 2015 11:30
Last Modified: 25 Sep 2018 09:29
URI: http://psasir.upm.edu.my/id/eprint/38675
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