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Reactive ion etching of 4H-SiC using SF6/O2 for MEMS application


Hezarjaribi, Yadollah and Hamidon, Mohd Nizar (2013) Reactive ion etching of 4H-SiC using SF6/O2 for MEMS application. The International Journal of Engineering and Science, 2 (2). pp. 87-92. ISSN 2319–1805; ESSN: 2319–1813


Deep Reactive Ion Etching (DRIE) of 4H-SiC performed using SF6/O2 plasma. The etching rates investigated as a function of the ratio of the O2 flow rate to total gas flow rate under different etching conditions such as the effect of power density, temperature, and the combination of chemistries on etching. The investigation was proven that the contribution and effect of the direct role of Oxygen to deep etching of SiC. An optimum value of O2 fraction of 60% to 40% Sulfur Hexafluoride (SF6) used to give high etching rate of 1.2μm/min. for maximum etching.

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Official URL or Download Paper: http://www.theijes.com/Vol,2,Issue,2.html

Additional Metadata

Item Type: Article
Divisions: Faculty of Engineering
Keywords: Deep Reactive Ion Etching (DRIE); Sulfur hexafluoride (SF6); 4H-SiC; Plasma
Depositing User: Nabilah Mustapa
Date Deposited: 25 Jul 2015 01:29
Last Modified: 11 Sep 2015 03:05
URI: http://psasir.upm.edu.my/id/eprint/28742
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