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Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field


Citation

Ruthramurthy, Balachandran and Yow, Ho Kwang and Ong, Boon Hoong and Tan, Kar Ban and Kassim, Anuar and Wong, Hin Yong (2011) Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field. International Journal of Electrochemical Science, 6 (8). pp. 3564-3579. ISSN 1452-3981

Abstract

NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycle of 50.00% under ultrasonic treatment. This deposition condition has significantly reduced the surface roughness from 39.01 ±1.1 nm to 6.96 ±1.1 nm and the spherical grain size in the range from 579.40 nm - 623.30 nm to 29.00 nm - 46.90 nm. On the other hand, the resistivity was reduced to 19.86 µωcm from 54.00 µωcm as the Ni content increased from 76.08% to 80.12 % for achieving good stoichiometry for NiFe thin films. Through the optimization study, the deposition current is observed to be the dominant factor in determining the single phase deposition of NiFe film whereas ultrasonic field and duty cycle significantly reduces the surface roughness and the spherical grain size, all of which combine to reduce film resistivity.


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Additional Metadata

Item Type: Article
Divisions: Faculty of Science
Publisher: Electrochemical Science Group
Keywords: NiFe thin films; Electrochemical reactions; Electrode materials; Surface morphology; Surface roughness; Resistivity
Depositing User: Nur Farahin Ramli
Date Deposited: 23 Aug 2013 01:19
Last Modified: 13 Jun 2019 03:27
URI: http://psasir.upm.edu.my/id/eprint/24904
Statistic Details: View Download Statistic

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