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Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.


Citation

Balachandran, R. and Yow, H. K. and Ong, Boon Hoong and Manickam, R. and Saaminathan, V. and Tan, Kar Ban (2009) Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate. Journal of Alloys and Compounds, 481 (1-2). pp. 336-339. ISSN 0925-8388; ESSN: 1873-4669

Abstract / Synopsis

NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning electron microscopy, respectively. The results show that the ultrasonic field has significantly improved the surface roughness, reduced the spherical grain size in the range from 490–575 nm to 90–150 nm, and increased the Ni content from 76.08% to 79.74% in the NiFe film electrodeposited.


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Additional Metadata

Item Type: Article
Divisions: Faculty of Science
DOI Number: https://doi.org/10.1016/j.jallcom.2009.02.129
Publisher: Elsevier
Keywords: Electrode materials; Metals and alloys; Electrochemical reactions.
Depositing User: Najwani Amir Sariffudin
Date Deposited: 15 May 2014 09:05
Last Modified: 02 Sep 2015 10:21
Altmetrics: http://www.altmetric.com/details.php?domain=psasir.upm.edu.my&doi=10.1016/j.jallcom.2009.02.129
URI: http://psasir.upm.edu.my/id/eprint/14424
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