Rice husk ash-enhanced Sn–5.0Sb-0.7Cu (SSC507) solder: Intermetallic layer growth and diffusion behavior

The impact of rice husk ash (RHA) on the formation of intermetallic compounds (IMCs) in SSC507-xRHA/Cu solder composite joints under isothermal aging conditions was investigated in this study. A range of solder systems (SSC507-xRHA; x = 0, 0.25, 0.5, 0.75, and 1.0 wt%) was prepared using the powder metallurgy technique. To examine the development of the interfacial IMCs, an isothermal aging procedure was applied to the solder/Cu joints for 500, 1000, and 1500 h at a temperature of 170 °C. According to experimental findings, the IMC layer thickness increased progressively with increasing aging time. Over a prolonged aging period, the morphology of the Cu6Sn5 IMC changed from scallop type to layer type, whereas the Cu3Sn IMC maintained a layer-type morphology throughout the aging process. In light of rice husk ash’s capability as a reinforcing material, the solder composite joints showed a notable decrease in the IMC layer growth. In comparison with the plain SSC507 solder, the SSC507-0.75RHA solder composite, which demonstrated the lowest IMC layer growth, showed reductions in IMC thickness of 42.4% and 22.7% under the as-soldered and 1500 h aged conditions, respectively. A thorough analysis of the growth kinetics showed that the existence of RHA in the solder composite joints effectively decreased the diffusion rate responsible for IMC growth. In comparison with the plain solder joint, which showed a diffusion coefficient of 10.3 × 10−14 cm2/s, the SSC507-0.75RHA showed the lowest diffusion coefficient of 8.83 × 10−14 cm2/s. These findings demonstrate that introducing an optimal amount of RHA enhances the interfacial durability and reliability of SSC507 solder connections for advanced electronic packaging applications by effectively inhibiting interfacial IMC development and diffusion kinetics.

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