Development of Test Procedure For CMOS Operational Amplifier Application Circuits
Abdul Halin, Izhal (2002) Development of Test Procedure For CMOS Operational Amplifier Application Circuits. Masters thesis, Universiti Putra Malaysia.
The integrated circuit (IC) is an ultra-small and fragile electrical system. A chip is basically an IC placed in a protective black plastic casing. The only contact the outside world has with the IC is through the chips input-output and power supply pins. ICs are also prone to damage and to locate damages inside a chip requires special probing techniques. These techniques are incorporated from the beginning of the design stage of a chip. Design for Testability (DFT) is a method applied to the design stage of chips such that electrical testing of the chips at the end of the production stage is greatly simplified. For a chip manufacturer, DFT helps cut production cost by shortening the time to test finished chips w hich eventually decreases the time to market the chip. Built-In Self Test (BIST) chips, an outcome of DFT, are ICs designed with extended circuitry dedicated to test its electrical behavior which eventually could inform a manufacturer w here damage has occurred. The testing circuitry inside a BIST chip is complimented by a test pattern, which is a special signal that executes the actual testing. The main objective of this study is to develop a test procedure to test CMOS Operational Amplifier (Op-Amp) application circuits. The focus in the development of the testing procedure is to find a suitable test pattern. The study conducted results in the success of developing the said test procedure. The development of the test procedure is aided by a powerful computer software from Tanner Research Inc. called Tanner Tools. It is used for circuit simulation and development of a mask layout for an Op-Amp. The major findings of this thesis is that a faulty Op-Amp application circuit behaves differently from a faultless Op-Amp application circuit. From this finding a test pattern can be derived by comparing between faulty and faultless Op-Amp application circuit behavior through simulation. The only disadvantage of the test pattern is that it could only detect damages in the Op-Amp if the damages occurs only one at any given time. Thus it can be argued that in relation to DFT for an Op-Amp application circuit, it is not impossible for damages to be pin-pointed using the developed procedure.
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