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A study on the effects of environment on curing characteristics of thixotropic and room temperature cured epoxy-based adhesives using DMTA


Citation

Ahmad, Zakiah and Hassan, Rohana and Md. Tahir, Paridah (2013) A study on the effects of environment on curing characteristics of thixotropic and room temperature cured epoxy-based adhesives using DMTA. ASM Science Journal, 7 (1). pp. 37-58. ISSN 1823-6782

Abstract / Synopsis

This study investigated the thermal properties of three room temperature curing adhesives containing nano-particles which were thixotropic and shear thinning which allowed injection into overhead holes when exposed to different environmental conditions. Viscosity and shear stress of the adhesives were measured as a function of shear rate. The thermal behaviour of the adhesives were measured using dynamic mechanical thermal analysis following exposure to different temperatures and humidities which included temperatures of 20°C. 30°C and 50°C, relative humidities of 65% RH, 75% RH and 95% RH, soaked in water at 20°C and placed in the oven at 50°C. The dynamic thermal properties reported include storage and loss modulus, the loss tangent and the glass transition temperature (Tg). For nano- and micro-particles filled adhesives, the Tg increased with the temperature increase, even though the adhesives were subjected to high humidity and this was due to further cross-linking. The results showed that room temperature cured epoxies were only partially cured at room temperature.


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Additional Metadata

Item Type: Article
Divisions: Institute of Tropical Forestry and Forest Products
Publisher: Academy of Sciences Malaysia
Keywords: DMTA; Epoxy-based adhesive; Glass transition temperature; Humidity; Nano- and micro-particles; Rheological properties; Thermal properties; Viscosity
Depositing User: Nurul Ainie Mokhtar
Date Deposited: 20 Jun 2016 14:51
Last Modified: 20 Jun 2016 14:51
URI: http://psasir.upm.edu.my/id/eprint/29183
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